| PART |
Description |
Maker |
| HT9015 |
RF Single Chip for Cordless Phone
|
Holtek Semiconductor Inc
|
| TEA7088A TEA7088AFP 4659 |
LOW-RANGE PHONE DEDICATED CHIP
From old datasheet system
|
SGS Thomson Microelectronics
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| AS2525 |
Single-Chip Handsfree Phone CMOS Integrated Circuit
|
Austria Mikro Systems
AMSCO[austriamicrosystems AG]
|
| T8301 |
T8301 Internet Protocol Telephone Phone-On-A-Chip?IP Solution DSP
T8301 Internet Protocol Telephone Phone-On-A-ChipIP Solution DSP
|
Agere Systems
|
| BCM1101 |
THE MOST HIGHLY INTEGRATED SILICON SOLUTION FOR FEATURE ENGANCED VOICE OVER IP ENTERPRISE PHONES
Enterprise IP Phone Chip
|
Electronic Theatre Controls, Inc.
ETC
Broadcom Corporation.
|
| DLBM-CG121 |
A Class 2 Bluetooth module suitable for cellular phone / smart phone applications
A Class 2 Bluetooth module suitable for cellular phone, smart phone applications.
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| TDFM2A-915E-10A TDFM3A-1907E-10A TDFS8A-915E-10A T |
TDF series for Mobile & Cordless Phone 1907 MHz, DIELECTRIC BPF
TDF series for Mobile & Cordless Phone
|
PLX Technology, Inc.
TOKO Inc.
TOKO[TOKO, Inc]
|
| CPC5620A CPC5620ATR CPC56201 CPC5621 CPC5621A CPC5 |
LITELINK? III Phone Line Interface IC (DAA)
LITELINK垄莽 III Phone Line Interface IC (DAA)
|
Clare, Inc.
|
| KF942FU |
Cellular Phone
|
Korea Electronics (KEC)
|
| ASJ-119-A |
PHONE JACK
|
Adam Technologies, Inc.
|
